The International Conference on Electronic Packaging Technology & High Density Packaging
(ICEPT-HDP2010)
16 - 19 August, 2010, Xi’an, China
The International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2010) is to be held in Xi’an, China, from August 16 to 19, 2010.Until 2009, ICEPT-HDP, which is organized by Electronic Manufacturing and Packaging Technology Society(EMPT) of Chinese Institute of Electronics, has been successfully held for ten times by some leading universities such as Tsinghua University, Fudan University, Harbin Institute of Technology, Huazhong University of Science & Technology and Shanghai Jiaotong University. This conference has provided a great technical platform for international and domestic experts, scholars, and researchers from academia and industries to exchange their ideas on the development of electronic packaging. As one of the most famous international conferences on electronic packaging technology, it was greatly supported by IEEE-CPMT, IMAPS, ASME and iNEMI, and highly appreciated by China Institute of Electronics and China Association of Science.
ICEPT-HDP 2010, co-organized by Xidian University, is a 4-day event. The conference will feature short courses, conference keynotes, special forums, technical sessions and posters to cover the technological developments in all the areas of electronic packaging. You are welcomed to submit an abstract and attend the conference.
Important Dates:
| April 20, 2010 | Paper Submission Deadline |
| May 17, 2010 | Notification of Acceptance |
| July 23, 2010 | Full Paper Due |
More information can be found at www.icept.org