Electronics reliability prognosis through material modeling and simulation

Nasser Loren, Curtin Maggie

Abstract:
Electronic systems, such as power supplies, are complex multilayered devices consisting of different materials with inherent variability. Thermal gradient cycling occurs during system operation which eventually results in thermo-mechanical fatigue induced material failure. Such material failures can result in immediate electronic system shutdown with no advanced fault or warning signals. This NAVAIR sponsored SBIR project uses state-of-the-art material modeling to predict degradation of circuit board elements as a means for "simulated fault detection." This effort has been focused on the specific aspect of solder fracture and fatigue since electronic industry statistics have attributed this failure issue as a driving factor in system reliability. This project demonstrates feasibility for using conventional sensing, combined with thermal modeling, to predict solder degradation due to thermal cycling as a means to prognosticate electronic power supply system reliability. Current status, as well as future plans, of electronic prognosis development will be discussed.

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