Material simulation-based electronic device prognosis

Nasser Loren, Tryon Robert, Dey Animesh

Abstract:
Electronic systems, such as power supplies, are complex multilayered devices consisting of different materials with inherent variability. Thermal gradient cycling occurs during system operation which eventually results in thermo-mechanical fatigue induced failure. Such failures can result in immediate electronic system shutdown with no advanced fault or warning signals; thus preventing the use of conventional fault-to-failure detection approaches as a means of predicting maintenance need. This NAVAIR sponsored SBIR project uses state-of-the-art material modeling to predict degradation of circuit board elements as a means for "simulated fault detection." This effort has been focused on the specific aspect of solder fracture and fatigue since electronic industry statistics have attributed this failure issue as a driving factor in system reliability. This project will demonstrate feasibility for using conventional, off-theshelf sensing, to predict solder degradation due to thermal cycling as a means to prognosticate electronic device reliability.

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